10 preparation methods for ceramic atomization core metal heating layer

The mainstream electronic cigarettes on the market now use ceramic or cotton cores to achieve atomization effects. Even if they are all cotton cores, there can be different heating wires, cotton, and so on; Similarly, even if they are all called ceramic cores, the implementation methods or principles may vary.
Ceramic substrates, with their excellent characteristics such as low thermal resistance, high pressure resistance, high heat dissipation, and long service life, have a wide range of application prospects in the fields of electronic fumigation and heating non combustion. The function of electronic cigarette heating elements is similar to that of computers to Intel chips, and the metallization circuit on the surface of ceramic substrates is an important prerequisite for its practical application.
The surface metallization process of ceramics has a wide range of applications in electronic ceramics. Due to its fast heating response, its application in the field of electronic cigarettes is gradually expanding. The following is an introduction to the surface metalization process of ceramic substrates compiled by the editor for reference;
1. Thick film technology
Thick film technology involves screen printing of metal powder slurry on ceramics, followed by high-temperature sintering and degreasing to melt the metal powder into a whole.
2. DPC Direct Plate Copper
Sputtering copper coating refers to the use of vacuum sputtering on the surface of Direct Plate Copper (DPC) to achieve thin film metallization, followed by high-density double-sided wiring and vertical interconnection using yellow light microscopy combined with perforation electroplating.
3. Bonded Copper Clad (DBC)
Direct Bond Copper (DPC) is a type of bonding material that involves depositing copper foil onto a ceramic surface. At high temperatures, a chemical reaction occurs at the interface to form a new phase, CuAlO2 or vermilion, which is tightly bonded. The advantage of this process is that it is suitable for secondary etching processing, with a thick copper layer and the highest reliability.
4. Bonded Aluminum Coating (DBA)
Direct Bond Aluminum (DPA) is a type of bonding material that utilizes the excellent wetting properties of aluminum on ceramics in liquid state to achieve the bonding of the two. By melting aluminum and directly wetting it onto the surface of ceramics, the bonding process is achieved. When the temperature rises to above 660 ℃, solid aluminum undergoes liquefaction. After wetting the ceramic surface with liquid aluminum, as the temperature decreases, aluminum directly provides crystal nucleation and growth on the ceramic surface, and cools to room temperature to achieve the combination of the two.
5. Active technology brazing
Active metal solder is printed on the surface of ceramics, and it is welded with oxygen free copper foil in a vacuum brazing furnace. The surface circuit is made using the wet etching process of PCB board. Brazing has small deformation, smooth and beautiful joints, and is suitable for welding components that are precise, complex, and composed of different materials.
6. Laser Selective Sintering (LAM)
Using high-energy laser beams to excite ceramic and metal ions, firmly bonding the two.
7. Chemical plating
Chemical plating technology is the deposition process of metals through controllable oxidation-reduction reactions under the catalytic action of metals.
8. Thermal spraying
Spray the molten spraying material (metal or non-metal) onto the surface of the pre treated substrate through high-speed airflow.
9. Plasma spraying
Use plasma arc to heat the metal to melt, and then impact the surface of the substrate under the traction of the plasma flow.
10. Molybdenum manganese method
Mix molybdenum manganese powder with organic binder to form a paste, apply it on the surface of ceramics, sinter at high temperature in a reducing atmosphere to obtain metallization, then nickel plating, and finally brazing with solder to metal parts.
Electronic cigarettes, as a type of oral suction product, have high requirements for food safety level. The most common method used in electronic cigarettes is thick film technology, which is applied in heating non combustible and e-liquid electronic cigarettes with heating elements.
The advantage of thick film technology lies in the ability to design multiple wiring schemes for products of the same size and resistance value, resulting in products with different effects; Targeted design of products to achieve optimal heat distribution, achieve good heating and atomization effects, and improve thermal efficiency to save electricity.